www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 1 of 5 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 91 1 f11 prepared checked approved ? d a t e 20 11 - 2 - 1 6 ??? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
saw filter hdf 91 1 f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 2 of 5 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
saw filter hdf 91 1 f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 3 of 5 1. package dimension unit:mm (f - 11) 2 . marking hd f91 1 1. color: black o r blue 2. 91 1.5 : center frequency(mhz) 3. performance 3.1 application low - loss saw filter of cordless system. center frequency:91 1.5 mhz 3.2 maximum rating operation temperature range - 4 0 to + 85 storage temperature range - 40 to +85 dc. permissive voltage 0 v dc. max. maximum input power 5dbm
saw filter hdf 91 1 f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 4 of 5 3.3 electronic characteristics item specification center frequency(fo) 91 1.5 mhz insertion loss(db) 1.) 911.5 mhz 2.)869 - 873 mhz 3.)8 88 - 8 9 2 mh z 4.)934 - 937 mhz 5.)955 - 960 mhz 6.)90 0 mhz 4.5 max 40 min 3 5 min 20 min 40 min 20 min. ripple deviation (9 07 - 9 16 mhz)(db) 1.5max input/output impedance(nominal) 50 3.4 frequency characteristics 3.5 test circuit
saw filter hdf 91 1 f11 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 5 of 5 4. environmental characterist ics 4 - 1 high temperature exposure subject the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 3.3 . 4 - 2 low temperature exposure subject the de vice to - 4 0 for 16 hours. then release the device into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications in 3.3 . 4 - 3 temperature cycling subject the device to a low temperature of - 40 for 30 minutes. follow ing by a high temperature of +8 5 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in 3.3 . 4 - 4 resistance to solder heat dip the device terminals no closer than 1.5m m into the solder bath at 260 10 for 10 1 sec. then release the device into the room conditions for 4 hours. the device shall meet the specifications in 3.3 . 4 - 5 solderability subject the device terminals into the solder bath at 245 5 for 5s, mor e than 95% area of the terminals must be covered with new solder. it shall meet the specifications in 3.3 . 4 - 6 mechanical shock drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 3.3 . 4 - 7 vibration subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the spe cifications in 3.3 . 5. remark 5.1 static voltage static voltage betw een signal load & ground may cause deterioration &destruction of the component. please avoid static voltage. 5.2 ultrasonic cleaning ultrasonic vibration may cause deteri oration & destruction of the component. please avoid ultrasonic cleaning 5.3 soldering only leads of component may be soldered. please avoid soldering another part of component.
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